| Process Code |
*Nadcap Commodity |
Limitation Codes |
Doc Notes |
Nomenclature |
Specification Number |
|
003
|
AQS
|
None |
None |
Boeing approved QMS as defined in D1-4426 Processor Requirements Sec 6.16.3 |
Quality System |
|
540
|
COMP
|
None |
None |
Metal to Metal (MM) Structural Bonding Class 1 per D-16925 (QPL) |
BAC 5514 |
|
541
|
COMP
|
None |
None |
Honeycomb (HC) -Classes 3, 4, or 5 per D-16925 (QPL) |
BAC 5514 |
|
542
|
CP
|
None |
None |
Phosphoric Acid Anodize (QPL) |
BAC 5555 |
|
M323
|
CP
|
None |
None |
Preparation of Metallic Materials for Adhesive Bonding Using Sol-Gel Process |
HP4-136 |
|
M542
|
CP
|
None |
None |
Phosphoric Acid Anodizing of Aluminum for Stuctural Adhesive Bonding |
HP4-137 |
|
M702
|
CP
|
None |
None |
Adhesive Primer Control (QPL) |
HP4-100 |
|
M707
|
COMP
|
None |
None |
Bonding - Honeycomb Nonmetallic Core (QPL) |
HP15-96 |
|
M710
|
COMP
|
None |
None |
Structural Bonding - High Strength - Metals - Nonmetallic (QPL) |
HP16-30 |